nFab has a variety of capabilities available. Please click on the following links for more information about each:
- Photolithagraphy bay including mask alignment and exposure, spincoating and development stations, bake ovens, microscope.
- Thin film RF or DC magnatron sputterng
- E-beam Evaporating
- Furnace for oxide, polysilicon, and doping
- Wire Bonding
- Wafer dicing
- Surface Profilometry with 3d mapping and film stress measurements
- Wet chemistry bay for wafer etching , cleaning, stripping, and etching. Custom process setups available.