Wayne State University

Capabilities

nFab has a variety of capabilities available. Please click on the following links for more information about each:

  • FIB/SEM
  • Photolithagraphy bay including mask alignment and exposure, spincoating and development stations, bake ovens, microscope.
  • DRIE
  • Thin film RF or DC magnatron sputterng
  • E-beam Evaporating
  • Furnace for oxide, polysilicon, and doping
  • PECVD
  • RIE
  • Wire Bonding
  • Wafer dicing
  • Surface Profilometry with 3d mapping and film stress measurements
  • Nanospec
  • Wet chemistry bay for wafer etching , cleaning, stripping, and etching. Custom process setups available.